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Mixed signal design aspects in digital mobile communication

Dr. Rolf Becker
ST-Ericsson, Zurich, Switzerland

8 hours, 2 credits

June 15 - June 16, 2011

Dipartimento di Ingegneria dell'Informazione: Elettronica, Informatica, Telecomunicazioni, via Caruso, meeting room, ground floor

Contacts: Prof. Roberto Saletti

Outline

• Basics of CMOS technology
• Fabrication technology
• Design elements (Transistors. Diodes. Resistors. Capacitors. Conduits. ESD elements)
• Audio Signal Processing
• Overview and standards
• Transmit or uplink path (Microphones. Pre-amplifiers. ADC topologies: time-continuous, time discrete. Filters: decimation, bandfilters)
• Receive or downlink path (Transducers: earpiece, loudspeaker, beepers. Drivers: class A, class AB, class D. DAC topologies. Noise shapers. Filters. Special elements: click and plop prevention, true-ground amplifiers, zero-crossing detectors)
• Baseband signal processing
• The various standards (GSM, EDGE, UMTS, TD-SCDMA)
• Radio blocks (Sytheziser. Receiver. Transmitter. AGC. Oscillator. PLL)
• Baseband receiver (ADC: multi-mode, dynamic range, jitter sensitivity, gain switching, intermodulation effects. Channel filters.)
• Baseband Transmitter (Modulators: spectrum, filtering. DAC topologies. Anti-alias filters. Multi-mode capability.
• PA power control (Control loops)