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ISCRIZIONE |
Automotive electronics and smart power
Instructor: Ing. Marco Morelli
Affiliation: STMicroelectronics, Cornaredo
Duration: 15 hours
Period: May 4 - 20, 2005
Place: Dipartimento di Ingegneria dell'Informazione: Elettronica, Informatica, Telecomunicazioni, via G. Caruso, meeting room, ground floor
Credits: 4
Contacts: Prof. Andrea Nannini
Aims
- Automotive electronics: marketing perspective
- Smart power devices: applications and technologies
- Reliability on smart power and memories
Contents
The first part deals with automotive electronics, analyzed from a semiconductor world perspective, specifically focusing on marketing and product management aspects. Moving from a brief description of the automotive world (vehicles production, geographical areas, car makers, automotive semiconductor market), it presents a list of main automotive applications, classified at system and/or subsystem level (power train, safety, car body, chassis). Some examples of typical application architecture (top level block diagrams) related to engine management, airbags and other electronics are provided. Main aspects of a typical (automotive) ASIC development flow and lifecycle are illustrated, presented in terms of a general overview (design, prototyping and industrialization phases). Presentation is completed by some hints relevant to future individual transportation systems, such as electric vehicles, hybrid cars, by-wire, fuel cells (hydrogen) equipments and related problematic.
In the second part we will cover a lot of examples of Smart Power devices and their applications, pointing out the major constrains and system solutions.
The BCD technology will be presented showing the solutions adopted to mix all the components on the same chip.
Fifteen minutes will be dedicated to a detailed description of HV DMOS transistors.
The seminar will show also an overview of some popular data converter architecture, focusing on their performance, field of application and design tradeoff.
Some example of practical implementations will be shown and finally few words will be spent about state of the art techniques and future trends.
Finally we will speak about reliability: purposes and methods to guarantee the life of smart power and memories, describing the challenges due to new technologies and materials.